A. Lamminen, M. Lahti, David del Río, J. Säily, J. F. Sevillano, V. Ermolov
{"title":"D波段多层高频PCB互连特性研究","authors":"A. Lamminen, M. Lahti, David del Río, J. Säily, J. F. Sevillano, V. Ermolov","doi":"10.1109/6GSUMMIT49458.2020.9083918","DOIUrl":null,"url":null,"abstract":"The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.","PeriodicalId":385212,"journal":{"name":"2020 2nd 6G Wireless Summit (6G SUMMIT)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Characterization of Interconnects on Multilayer High Frequency PCB for D- Band\",\"authors\":\"A. Lamminen, M. Lahti, David del Río, J. Säily, J. F. Sevillano, V. Ermolov\",\"doi\":\"10.1109/6GSUMMIT49458.2020.9083918\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.\",\"PeriodicalId\":385212,\"journal\":{\"name\":\"2020 2nd 6G Wireless Summit (6G SUMMIT)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 2nd 6G Wireless Summit (6G SUMMIT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/6GSUMMIT49458.2020.9083918\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 2nd 6G Wireless Summit (6G SUMMIT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/6GSUMMIT49458.2020.9083918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization of Interconnects on Multilayer High Frequency PCB for D- Band
The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.
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