片上电容对I/O电路和核心电路的影响

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967614

T. Sudo, K. Nakano, J. Kudo, S. Haga

{"title":"片上电容对I/O电路和核心电路的影响","authors":"T. Sudo, K. Nakano, J. Kudo, S. Haga","doi":"10.1109/EPEP.2001.967614","DOIUrl":null,"url":null,"abstract":"This paper presents experimental results for two types of CMOS VLSI test chips that were with and without on-chip capacitance. Radiated emission and simultaneous switching were characterized by activating I/O circuits or core logic circuits.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Characterization of on-chip capacitance effects for I/O circuits and core circuits\",\"authors\":\"T. Sudo, K. Nakano, J. Kudo, S. Haga\",\"doi\":\"10.1109/EPEP.2001.967614\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents experimental results for two types of CMOS VLSI test chips that were with and without on-chip capacitance. Radiated emission and simultaneous switching were characterized by activating I/O circuits or core logic circuits.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967614\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

摘要

本文介绍了两种CMOS VLSI测试芯片在片上电容和片上电容两种情况下的实验结果。辐射发射和同步开关的特征是激活I/O电路或核心逻辑电路。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterization of on-chip capacitance effects for I/O circuits and core circuits

This paper presents experimental results for two types of CMOS VLSI test chips that were with and without on-chip capacitance. Radiated emission and simultaneous switching were characterized by activating I/O circuits or core logic circuits.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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