{"title":"电力电子电路的热电冷却:建模和应用","authors":"Cong Li, Da Jiao, H. Mohan, F. Guo, Jin Wang","doi":"10.1109/APEC.2013.6520770","DOIUrl":null,"url":null,"abstract":"This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.","PeriodicalId":256756,"journal":{"name":"2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Thermoelectric Cooling for power electronics circuits: Modeling and applications\",\"authors\":\"Cong Li, Da Jiao, H. Mohan, F. Guo, Jin Wang\",\"doi\":\"10.1109/APEC.2013.6520770\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.\",\"PeriodicalId\":256756,\"journal\":{\"name\":\"2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC.2013.6520770\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2013.6520770","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermoelectric Cooling for power electronics circuits: Modeling and applications
This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.