关于使用OPC UA垂直集成半导体前端的工业反馈

F. R. Golra, M. Engel
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引用次数: 0

摘要

随着制造业普遍采用工业4.0,OPC UA正在获得牵引力,成为克服互操作性问题的事实上的体系结构。尽管半导体设备制造商需要遵守现有的和现在成熟的semi - 11semi是一个定义标准的半导体协会。本文中引用的所有SEMI标准都可以在https://www.semi.org标准上访问,值得探索与其他自动化标准协调的可能性。出于同样的动机,OPC基金会为不同的其他标准(如ISA-95、PROFINET、IO-Link等)开发了标准化的配套规范。在缺乏半导体行业配套规范的情况下,本文比较了半导体行业信息模型开发的体系结构选择。我们分享了在半导体领域实现OPC UA信息模型的经验教训。
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An industrial feedback on the use of OPC UA for the vertical integration of semiconductor front-ends
As manufacturing, in general, is adopting Industry 4.0, OPC UA is gaining traction to become the de facto architecture for overcoming the issues of interoperability. Even though semiconductor equipment manufacturers need to comply with the existing and now mature SEMI11SEMI is a semiconductor association that defines standards. All SEMI standards referenced in this article are accessible at https://www.semi.org standards, it is worthwhile to explore the possibilities of harmonizing them with other automation standards. Following the same motivation, OPC Foundation has developed standardized companion specifications for different other standards like ISA-95, PROFINET, IO-Link, etc. In the absence of a companion specification for semiconductor industry, this work compares the architectural choices for the development of an information model for semiconductor industry. We share the lessons learned from our endeavors in implementing OPC UA information models for semiconductor domain.
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