{"title":"真空加压浸渍过程的介电分析,以评估新开发的V.P.I胶条的浸渍特性","authors":"J. W. Roberts, Sahag Ohanesian","doi":"10.1109/EIC.1985.7458571","DOIUrl":null,"url":null,"abstract":"1. A new V.P.I. tape has been developed which exhibits: a) The physical strength and flexibility for high speed taping b) Good impregnation properties c) Compatibility with a range of commercially available V.P.I. resins d) Outstanding electrical properties e) Long shelf-life f) No history of dermatitis problems","PeriodicalId":188957,"journal":{"name":"1985 EIC 17th Electrical/Electronics Insulation Conference","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1985-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Dielectric analysis of a vacuum pressure impregnation process to evaluate impregnating characteristics of a newly developed V.P.I, tape\",\"authors\":\"J. W. Roberts, Sahag Ohanesian\",\"doi\":\"10.1109/EIC.1985.7458571\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"1. A new V.P.I. tape has been developed which exhibits: a) The physical strength and flexibility for high speed taping b) Good impregnation properties c) Compatibility with a range of commercially available V.P.I. resins d) Outstanding electrical properties e) Long shelf-life f) No history of dermatitis problems\",\"PeriodicalId\":188957,\"journal\":{\"name\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1985-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1985 EIC 17th Electrical/Electronics Insulation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1985.7458571\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1985 EIC 17th Electrical/Electronics Insulation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1985.7458571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dielectric analysis of a vacuum pressure impregnation process to evaluate impregnating characteristics of a newly developed V.P.I, tape
1. A new V.P.I. tape has been developed which exhibits: a) The physical strength and flexibility for high speed taping b) Good impregnation properties c) Compatibility with a range of commercially available V.P.I. resins d) Outstanding electrical properties e) Long shelf-life f) No history of dermatitis problems