基于硅的大规模单片SAW卷积/相关器

M. E. Motamedi, M. Kilcoyne, R.K. Asaourian
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引用次数: 7

摘要

卷积器和相关器是扩频通信系统的关键部件。在扩频通信系统中,这些器件最有效地用作匹配滤波元件,以提高信噪比。描述了硅半导体衬底上单片SAW卷积/相关器的基本设计、制造和工作参数。无源卷积器,如金属氧化锌半导体结构,和有源卷积器,如PI-FET将被包括在内。通过使用氧化锌压电薄膜材料,声电SAW和半导体电子器件元件可以在同一单片衬底上制造。这种单片信号处理器的发展有望导致非常大的时间带宽器件单片集成在单一衬底上,与低成本批量制造技术兼容。设备表征主要是利用HP-9845计算机控制的HP-8505自动网络分析仪系统进行的。利用该体系对ZnO/Si结构的转导性能进行了评价。本文讨论了在3英寸硅片上成功制造的1.6英寸和10 p声延迟器件的最先进的SAW单片技术。这些大型器件工作频率为340 MHz,在馈通水平为90 dB时,插入损耗优于35 dB,动态范围优于55 dB。
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Large-Scale Monolithic SAW Convolver/Correlator on Silicon
Convolver and correlator devices are key components for spread-spectrum communication systems. These devices are employed most effectively as matched filter elements to improve the signal-to-noise ratio in spread-spectrum communication systems. The basic design, fabrication, and operaling parameters of a monolithic SAW convolver/ correlator on a silicon semiconductor substrate are described. Both passive convolvers, such as metal-zinc oxide semiconductor structures, and active convolvers, such as PI-FET will be included. By use of a zinc oxide (ZnO) piezoelectric thin film material, both acoustoeleclric SAW and semiconductor electronic device components may be fabricated on the same monolithic substrate. The development of such monolithic signal processors is expected to result in very large time-bandwidth devices monolithically integrated on a single substrate compatible with low cost batch fabrication techniques. The device characterization is mainly performed by using an HP-8505 automatic network analyzer system controlled by an HP-9845 computer. Using this ystem, the transduction properties of ZnO/Si structures were evaluated. State-ofthe-art SAW monolithic technology is discussed for devices as long as 1.6 in and acoustic delays of 10 p , which are successfully fabricated on 3-in Si wafers. These large-scale devices are operating at 340 MHz and demonstrate insertion loss better than 35 dB at a feedthrough level of 90 dB, resulting in a dynamic range of better than 55 dB.
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