一个可扩展的嵌入式DSP核心的SoC应用

C. Panis, U. Hirnschrott, S. Farfeleder, A. Krall, G. Laure, W. Lazian, J. Nurmi
{"title":"一个可扩展的嵌入式DSP核心的SoC应用","authors":"C. Panis, U. Hirnschrott, S. Farfeleder, A. Krall, G. Laure, W. Lazian, J. Nurmi","doi":"10.1109/ISSOC.2004.1411155","DOIUrl":null,"url":null,"abstract":"Increasing system complexity of SoC (system-on-chip) and SiP (system-in-package) applications leads to the strong demand of platform based solutions. Software programmable embedded cores are required to provide flexibility to these platforms. Compared with dedicated hardware implementations the provided flexibility leads to increased silicon area and power dissipation, which is problematic for high volume products. This paper introduces xDSPcore, a scalable embedded DSP processor which allows to scale major architectural features to application specific requirements. Compatibility issues caused by different core versions are covered by the support of efficient programming in high-level languages like C, which is achieved by an optimizing C-compiler and by a compiler friendly core architecture. A particular core definition is specified by a XML based configuration file.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"A scalable embedded DSP core for SoC applications\",\"authors\":\"C. Panis, U. Hirnschrott, S. Farfeleder, A. Krall, G. Laure, W. Lazian, J. Nurmi\",\"doi\":\"10.1109/ISSOC.2004.1411155\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Increasing system complexity of SoC (system-on-chip) and SiP (system-in-package) applications leads to the strong demand of platform based solutions. Software programmable embedded cores are required to provide flexibility to these platforms. Compared with dedicated hardware implementations the provided flexibility leads to increased silicon area and power dissipation, which is problematic for high volume products. This paper introduces xDSPcore, a scalable embedded DSP processor which allows to scale major architectural features to application specific requirements. Compatibility issues caused by different core versions are covered by the support of efficient programming in high-level languages like C, which is achieved by an optimizing C-compiler and by a compiler friendly core architecture. A particular core definition is specified by a XML based configuration file.\",\"PeriodicalId\":268122,\"journal\":{\"name\":\"2004 International Symposium on System-on-Chip, 2004. Proceedings.\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 International Symposium on System-on-Chip, 2004. Proceedings.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSOC.2004.1411155\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSOC.2004.1411155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

摘要

SoC(片上系统)和SiP(系统级封装)应用的系统复杂性不断增加,导致对基于平台的解决方案的强烈需求。软件可编程嵌入式内核需要为这些平台提供灵活性。与专用硬件实现相比,提供的灵活性导致硅面积和功耗增加,这对于大批量产品来说是一个问题。本文介绍了xDSPcore,一个可扩展的嵌入式DSP处理器,它允许扩展主要架构特性以满足特定的应用需求。不同核心版本导致的兼容性问题可以通过支持C等高级语言的高效编程来解决,这是通过优化C编译器和编译器友好的核心体系结构实现的。特定的核心定义由基于XML的配置文件指定。
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A scalable embedded DSP core for SoC applications
Increasing system complexity of SoC (system-on-chip) and SiP (system-in-package) applications leads to the strong demand of platform based solutions. Software programmable embedded cores are required to provide flexibility to these platforms. Compared with dedicated hardware implementations the provided flexibility leads to increased silicon area and power dissipation, which is problematic for high volume products. This paper introduces xDSPcore, a scalable embedded DSP processor which allows to scale major architectural features to application specific requirements. Compatibility issues caused by different core versions are covered by the support of efficient programming in high-level languages like C, which is achieved by an optimizing C-compiler and by a compiler friendly core architecture. A particular core definition is specified by a XML based configuration file.
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