任意形状导电结构的耦合电磁电路仿真

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967653

Yong Wang, V. Jandhyala, C. Shi

{"title":"任意形状导电结构的耦合电磁电路仿真","authors":"Yong Wang, V. Jandhyala, C. Shi","doi":"10.1109/EPEP.2001.967653","DOIUrl":null,"url":null,"abstract":"This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures\",\"authors\":\"Yong Wang, V. Jandhyala, C. Shi\",\"doi\":\"10.1109/EPEP.2001.967653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967653\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967653","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 25

摘要

本文提出了一种基于三角曲面网格的部分单元等效电路(PEEC)方法。定义在三角形镶嵌上的Rao-Wilton-Glisson (RWG)基函数通过SPICE兼容网络表对任意形状的导电结构进行建模。这种方法对芯片上电磁相互作用的建模有潜在的用处。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures

This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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