三维电荷阱NAND闪存的性能、可靠性和阈值电压分布的特性综述

Weihua Liu, Fei Wu, Xiang Chen, Meng Zhang, Yu Wang, Xiangfeng Lu, Changsheng Xie
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引用次数: 8

摘要

在高性能存储场景中,SSD (Solid-state drive)逐渐占据主导地位。具有高存储容量的三维NAND闪存正在成为SSD的主流存储组件。然而,新型三维电荷阱(CT) NAND闪存的干扰变得前所未有的复杂,产生了许多关于可靠性和性能的问题。解决这些问题需要深入了解3D CT NAND闪存的特性。为了便于理解,在本文中,我们深入研究了3D CT NAND闪存的性能、可靠性和阈值电压(Vth)分布。我们总结了这些具有多重干扰和变化的特征,并给出了一些新的见解和表征方法。特别地,我们描述了3D NAND闪存的歪斜(Vth)分布、(Vth)移位规律和独占层变化。表征是设计更可靠和高效的基于闪存的存储解决方案的支柱。
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Characterization Summary of Performance, Reliability, and Threshold Voltage Distribution of 3D Charge-Trap NAND Flash Memory
Solid-state drive (SSD) gradually dominates in the high-performance storage scenarios. Three-dimension (3D) NAND flash memory owning high-storage capacity is becoming a mainstream storage component of SSD. However, the interferences of the new 3D charge-trap (CT) NAND flash are getting unprecedentedly complicated, yielding to many problems regarding reliability and performance. Alleviating these problems needs to understand the characteristics of 3D CT NAND flash memory deeply. To facilitate such understanding, in this article, we delve into characterizing the performance, reliability, and threshold voltage (Vth) distribution of 3D CT NAND flash memory. We make a summary of these characteristics with multiple interferences and variations and give several new insights and a characterization methodology. Especially, we characterize the skewed (Vth) distribution, (Vth) shift laws, and the exclusive layer variation in 3D NAND flash memory. The characterization is the backbone of designing more reliable and efficient flash-based storage solutions.
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