{"title":"降低与损耗元件共振时的功率母线阻抗","authors":"T. Zeeff, T. Hubing","doi":"10.1109/EPEP.2001.967611","DOIUrl":null,"url":null,"abstract":"Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"385 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"Reducing power bus impedance at resonance with lossy components\",\"authors\":\"T. Zeeff, T. Hubing\",\"doi\":\"10.1109/EPEP.2001.967611\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"385 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967611\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967611","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reducing power bus impedance at resonance with lossy components
Power bus structures in printed circuit boards with solid power and ground planes exhibit resonances. When the power bus is resonant, the power bus impedance can increase dramatically. This paper explores the effect of component equivalent series resistance (ESR) on power bus resonances. General guidelines for selecting an optimum ESR are provided and are supported by laboratory measurements and numerical simulations.