带顶盖的耦合微带线中的串扰和低频辐射

J. Bernal, F. Mesa, D. Jackson
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引用次数: 2

摘要

本文采用全波法分析了金属顶盖耦合微带传输线的传输特性。由于电路封装,这种金属顶盖可能存在于微带结构中。结果表明,在低频率下,该结构可以激发出偶漏模和不适当的奇模。因此,通常在高频微带传输线中发现的辐射、功率损耗和干扰等效应在低频微带传输线中出现,从而损害了线路上的信号完整性。我们提供的数值结果表明,即使在线路的横截面远小于波长的频率下,基于准tem近似和传输线理论的传统分析也不能准确预测该线路的信号传播和串扰。
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Crosstalk and low frequency radiation in a coupled microstrip line with a top cover
In this work we use a full-wave method to analyze the propagation characteristics of a coupled microstrip transmission line with a metallic top cover. This metallic top cover may be present in a microstrip structure due to a circuit package. We show that an even leaky mode and an improper odd mode can be excited in this structure at low frequencies. As a consequence, effects as radiation, power loss, and interference, which are usually found in microstrip transmission lines at high frequencies, appear instead in this structure at low frequencies, thus compromising the signal integrity on the line. We provide numerical results to demonstrate that signal propagation and crosstalk for this line cannot be accurately predicted by a conventional analysis based upon a quasi-TEM approximation and transmission line theory even at frequencies such that the cross section of the line is much smaller than the wavelength.
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