光集成光纤:恶劣环境传感的新平台

C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith
{"title":"光集成光纤:恶劣环境传感的新平台","authors":"C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith","doi":"10.1109/AVFOP.2015.7356614","DOIUrl":null,"url":null,"abstract":"This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.","PeriodicalId":187785,"journal":{"name":"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optically integrated fiber: A new platform for harsh environmental sensing\",\"authors\":\"C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith\",\"doi\":\"10.1109/AVFOP.2015.7356614\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.\",\"PeriodicalId\":187785,\"journal\":{\"name\":\"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AVFOP.2015.7356614\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AVFOP.2015.7356614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

这项工作报告了一种直接将光纤集成在平面基板上的新型光学平台。制造方法使用火焰水解沉积形成光学动态以及机械强复合材料。由此产生的平台有利于实现MEMS微结构的平面制造技术;机械连续的片内片外互连,消除了对传统脆弱耦合方法的依赖;并且与布拉格光栅铭文兼容,允许多路多参数传感。化学传感是通过芯片上的倏逝场暴露来演示的,物理传感是通过使用集成微结构来演示的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Optically integrated fiber: A new platform for harsh environmental sensing
This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Applications of photonics for spatial and spectral processing of microwave and millimeter-wave signals Integration of an X-band antenna array with high power photodiodes Integrated optical beamformers The evolution of integrated photonics at Sandia National laboratories Optical frequency combs from mode-locked diode lasers - applications in communications, signal processing & radar for avionics
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1