C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith
{"title":"光集成光纤:恶劣环境传感的新平台","authors":"C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith","doi":"10.1109/AVFOP.2015.7356614","DOIUrl":null,"url":null,"abstract":"This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.","PeriodicalId":187785,"journal":{"name":"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optically integrated fiber: A new platform for harsh environmental sensing\",\"authors\":\"C. Holmes, L. Carpenter, J. Gates, Peter G. R. Smith\",\"doi\":\"10.1109/AVFOP.2015.7356614\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.\",\"PeriodicalId\":187785,\"journal\":{\"name\":\"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AVFOP.2015.7356614\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AVFOP.2015.7356614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optically integrated fiber: A new platform for harsh environmental sensing
This work reports a new optical platform that directly integrates optical fiber upon a planar substrate. The fabrication methodology uses flame hydrolysis deposition to form an optically dynamic as well as mechanically strong composite. The resulting platform is conducive to planar fabrication techniques enabling MEMS microstucturing; mechanically continuous on-chip-off-chip interconnects, removing the dependency upon traditionally vulnerable coupling methods; and is compatible with Bragg grating inscription, permitting multiplexed multiparameter sensing. Chemical sensing is demonstrated through on-chip evanescent field exposure and physical sensing is demonstrated through use of integrated microstructures.