{"title":"亚微米领域的可制造性设计","authors":"Wojciech Maly, H. Heineken, J. Khare, P. Nag","doi":"10.1109/ICCAD.1996.571365","DOIUrl":null,"url":null,"abstract":"Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional \"design rules\" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.","PeriodicalId":408850,"journal":{"name":"Proceedings of International Conference on Computer Aided Design","volume":"197 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":"{\"title\":\"Design for manufacturability in submicron domain\",\"authors\":\"Wojciech Maly, H. Heineken, J. Khare, P. Nag\",\"doi\":\"10.1109/ICCAD.1996.571365\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional \\\"design rules\\\" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.\",\"PeriodicalId\":408850,\"journal\":{\"name\":\"Proceedings of International Conference on Computer Aided Design\",\"volume\":\"197 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"55\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Conference on Computer Aided Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1996.571365\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Conference on Computer Aided Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1996.571365","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
