{"title":"最新功率放大器集成电路综述","authors":"iSwee Liu, Kaixue Ma, Shouxian Mou, F. Meng","doi":"10.1109/GSMM.2017.7970329","DOIUrl":null,"url":null,"abstract":"This paper given a brief and concise discussion on latest research of RFIC power amplifier (PA) designs, showing the frontier state-of-the-art developments, and then present our PA designs and some typical newest designs in expertise area with three technologies, a.k.a CMOS, SiGe, and III-V semiconductor. At last, three research hotspots and research trends about on chip PA are summarized and discussed.","PeriodicalId":414423,"journal":{"name":"2017 10th Global Symposium on Millimeter-Waves","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A review of recent power amplifier IC\",\"authors\":\"iSwee Liu, Kaixue Ma, Shouxian Mou, F. Meng\",\"doi\":\"10.1109/GSMM.2017.7970329\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper given a brief and concise discussion on latest research of RFIC power amplifier (PA) designs, showing the frontier state-of-the-art developments, and then present our PA designs and some typical newest designs in expertise area with three technologies, a.k.a CMOS, SiGe, and III-V semiconductor. At last, three research hotspots and research trends about on chip PA are summarized and discussed.\",\"PeriodicalId\":414423,\"journal\":{\"name\":\"2017 10th Global Symposium on Millimeter-Waves\",\"volume\":\"90 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 10th Global Symposium on Millimeter-Waves\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GSMM.2017.7970329\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 10th Global Symposium on Millimeter-Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GSMM.2017.7970329","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper given a brief and concise discussion on latest research of RFIC power amplifier (PA) designs, showing the frontier state-of-the-art developments, and then present our PA designs and some typical newest designs in expertise area with three technologies, a.k.a CMOS, SiGe, and III-V semiconductor. At last, three research hotspots and research trends about on chip PA are summarized and discussed.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
