{"title":"3.3V CMOS厚膜SOI超紧凑SP4T蜂窝天线开关","authors":"V. Blaschke, A. Unikovski, R. Zwingman","doi":"10.1109/IEEE-IWS.2013.6616791","DOIUrl":null,"url":null,"abstract":"This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.","PeriodicalId":344851,"journal":{"name":"2013 IEEE International Wireless Symposium (IWS)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"An ultra-compact SP4T cellular antenna switch in 3.3V CMOS thick-film SOI\",\"authors\":\"V. Blaschke, A. Unikovski, R. Zwingman\",\"doi\":\"10.1109/IEEE-IWS.2013.6616791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.\",\"PeriodicalId\":344851,\"journal\":{\"name\":\"2013 IEEE International Wireless Symposium (IWS)\",\"volume\":\"74 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Wireless Symposium (IWS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEEE-IWS.2013.6616791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Wireless Symposium (IWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEEE-IWS.2013.6616791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An ultra-compact SP4T cellular antenna switch in 3.3V CMOS thick-film SOI
This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.