3.3V CMOS厚膜SOI超紧凑SP4T蜂窝天线开关

V. Blaschke, A. Unikovski, R. Zwingman
{"title":"3.3V CMOS厚膜SOI超紧凑SP4T蜂窝天线开关","authors":"V. Blaschke, A. Unikovski, R. Zwingman","doi":"10.1109/IEEE-IWS.2013.6616791","DOIUrl":null,"url":null,"abstract":"This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.","PeriodicalId":344851,"journal":{"name":"2013 IEEE International Wireless Symposium (IWS)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"An ultra-compact SP4T cellular antenna switch in 3.3V CMOS thick-film SOI\",\"authors\":\"V. Blaschke, A. Unikovski, R. Zwingman\",\"doi\":\"10.1109/IEEE-IWS.2013.6616791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.\",\"PeriodicalId\":344851,\"journal\":{\"name\":\"2013 IEEE International Wireless Symposium (IWS)\",\"volume\":\"74 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Wireless Symposium (IWS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEEE-IWS.2013.6616791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Wireless Symposium (IWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEEE-IWS.2013.6616791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文介绍了一种3.3V CMOS厚膜SOI超紧凑SP4T天线开关的设计和表征结果。通过“布局驱动”电路设计,实现了一个包含rf部分、I/O焊盘、ESD、解码器、电平移位器和负vss电荷泵的全集成开关芯片的小芯片尺寸为0.53 mm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
An ultra-compact SP4T cellular antenna switch in 3.3V CMOS thick-film SOI
This paper presents design and characterization results of an ultra-compact SP4T antenna switch fabricated in 3.3V CMOS thick-film SOI. Through “layout-driven” circuit design a small die size of 0.53 mm2 was achieved for a fully integrated switch die containing RF-section, I/O pads, ESD, decoder, level shifters and negative vss charge pump.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Behavioral modeling of power amplifier with long term memory effects using recurrent neural networks Ultra-wideband (UWB) bandpass filter based on stub-loaded ring resonator Differential bandpass filter with high common-mode rejection ratio inside the differential-mode passband using controllable common-mode transmission zero Analysis and design of CMOS Doherty power amplifier using voltage combining method Experimental study of effects of coaxial cables in magnetic resonant wireless power transfer system
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1