增材制造零件超声磨料抛光:工艺参数对抛光性能影响的实验研究

X. Liu, J. Wang, J. Zhu, P. Liew, C. Li, C. Huang
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引用次数: 3

摘要

基于粉末的层状增材制造(AM)技术如选择性激光熔化(SLM)所生产的金属零件表面粗糙是一个需要解决的重要问题。采用超声磨料抛光(UAP)技术,利用磨粒的空化塌陷和微切割对表面进行精加工,可以明显改善增材制造零件的表面质量。采用L_9(3^4)正交试验设计方法,研究超声功率、加工时间、磨粒粒度、磨粒浓度对表面粗糙度Ra和材料去除率的影响。研究了料浆中磨料颗粒的磨损情况。选择选择性激光熔化(SLM)法制备的IN625镍基合金试样作为靶件。结果表明:当超声输出功率过大时,表面质量和加工效率都会下降;仅增加加工时间不能进一步提高表面粗糙度Ra。抛光过程中出现了严重的空蚀现象,在工件表面产生了残余凹坑,对Ra的影响较大。磨料颗粒的大小和数量应在一定范围内,有利于材料的去除和抛光性能的提高。本文的工作对研究影响UAP的工艺参数,找出合适的工艺条件有一定的指导意义。
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Ultrasonic abrasive polishing of additive manufactured parts: An experimental study on the effects of process parameters on polishing performance
The rough surface of metal parts produced by the powder-based layered Additive Manufacturing (AM) technology such as Selective Laser Melting (SLM) is an important problem that needs to be solved. This study introduces obvious improvements in the surface quality of the AM parts by means of ultrasonic abrasive polishing (UAP), which uses cavitation collapse and micro-cut of abrasive particles for finishing surfaces. Experiments were conducted using the orthogonal experimental design method with an L_9(3^4) orthogonal array to investigate the effects of ultrasonic power, machining time, abrasive particle size, and particle concentration on surface roughness Ra and material removal rate (MRR). The wear of the abrasive particles in the slurry was also studied. IN625 nickel-based alloy specimen manufactured by Selective Laser Melting (SLM) was chosen as the target workpiece. The results show that when the ultrasonic output power was too high, both surface quality and machining efficiency were deteriorated. And the surface roughness Ra was not further improved by just increasing the machining time. Severe cavitation erosion occurred in the polishing process and created leftover pits on the workpiece surface, which has a large influence on Ra. The size and amount of the abrasive particles should be within a certain range, which is helpful for material removal and improving the polishing performance. The work is useful for studying the influential process parameters involved in UAP and finding out the appropriate conditions.
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