J. Vangilder, Yatharth Vaishnani, W. Tian, M. Condor
{"title":"一种用于数据中心CFD建模的紧凑机架模型","authors":"J. Vangilder, Yatharth Vaishnani, W. Tian, M. Condor","doi":"10.1109/ITherm45881.2020.9190187","DOIUrl":null,"url":null,"abstract":"We propose a compact rack model which provides the capabilities of an explicitly-detailed model and the computational efficiency of a black-box model. The proposed model idealizes internal-rack airflows as conforming to a well-defined flow network topology. It predicts IT-equipment inlet temperatures (which depend on internal-rack recirculations) and pressure-driven leakage airflows. Consequently, it can model, for example, contained and uncontained architectures, the effects of under-rack cable cutouts, and ceiling-ducted racks (with a sealed rear door).The model is efficient and robust because it eliminates the need to explicitly model small-scale features in large-scale data-center CFD simulations while not appreciably increasing computational cost relative to the simplest black-box models. It has the potential for high accuracy as internal-rack flow resistances are taken directly from experimental measurements and inputs may be tailored to any rack population or application.","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A Compact Rack Model for Data Center CFD Modeling\",\"authors\":\"J. Vangilder, Yatharth Vaishnani, W. Tian, M. Condor\",\"doi\":\"10.1109/ITherm45881.2020.9190187\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We propose a compact rack model which provides the capabilities of an explicitly-detailed model and the computational efficiency of a black-box model. The proposed model idealizes internal-rack airflows as conforming to a well-defined flow network topology. It predicts IT-equipment inlet temperatures (which depend on internal-rack recirculations) and pressure-driven leakage airflows. Consequently, it can model, for example, contained and uncontained architectures, the effects of under-rack cable cutouts, and ceiling-ducted racks (with a sealed rear door).The model is efficient and robust because it eliminates the need to explicitly model small-scale features in large-scale data-center CFD simulations while not appreciably increasing computational cost relative to the simplest black-box models. It has the potential for high accuracy as internal-rack flow resistances are taken directly from experimental measurements and inputs may be tailored to any rack population or application.\",\"PeriodicalId\":193052,\"journal\":{\"name\":\"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITherm45881.2020.9190187\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITherm45881.2020.9190187","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We propose a compact rack model which provides the capabilities of an explicitly-detailed model and the computational efficiency of a black-box model. The proposed model idealizes internal-rack airflows as conforming to a well-defined flow network topology. It predicts IT-equipment inlet temperatures (which depend on internal-rack recirculations) and pressure-driven leakage airflows. Consequently, it can model, for example, contained and uncontained architectures, the effects of under-rack cable cutouts, and ceiling-ducted racks (with a sealed rear door).The model is efficient and robust because it eliminates the need to explicitly model small-scale features in large-scale data-center CFD simulations while not appreciably increasing computational cost relative to the simplest black-box models. It has the potential for high accuracy as internal-rack flow resistances are taken directly from experimental measurements and inputs may be tailored to any rack population or application.