采用新型系统级封装技术设计埋入式SiGe mmic的77ghz互连

2008 European Microwave Integrated Circuit Conference Pub Date : 2008-10-01 DOI:10.1109/EUMC.2008.4751770

M. Richter, K. Becker, L. Bottcher, M. Schneider

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引用次数: 5

摘要

本文介绍了采用微孔技术实现埋置有源77ghz芯片与高频基板互连的设计、仿真和测量。所提出的嵌入技术为非常广泛的频率和应用范围提供了巨大的机会，以及降低成本的巨大潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology

This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.

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2008 European Microwave Integrated Circuit Conference

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