{"title":"不同技术世代的泄漏改善和过程补偿的最佳体偏置选择","authors":"C. Neau, K. Roy","doi":"10.1109/LPE.2003.1231846","DOIUrl":null,"url":null,"abstract":"We present techniques to determine the optimal body bias (forward or reverse) to minimize leakage current and compensate process variations in scaled CMOS technologies. A circuit trades off sub-threshold leakage with band-to-band tunneling leakage at the source/drain junctions to determine the optimal substrate bias for different technology generations and under process variations. Using optimal body bias results in 43% and 42% savings in leakage for predictive 70 nm and 50 nm NMOS devices, respectively. This technique also reduces the effects of die-to-die and intra-die process variations in transistor length and supply voltage by 43% and 60%, respectively, in 50 nm NMOS devices, resulting in improved yield.","PeriodicalId":355883,"journal":{"name":"Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"115","resultStr":"{\"title\":\"Optimal body bias selection for leakage improvement and process compensation over different technology generations\",\"authors\":\"C. Neau, K. Roy\",\"doi\":\"10.1109/LPE.2003.1231846\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present techniques to determine the optimal body bias (forward or reverse) to minimize leakage current and compensate process variations in scaled CMOS technologies. A circuit trades off sub-threshold leakage with band-to-band tunneling leakage at the source/drain junctions to determine the optimal substrate bias for different technology generations and under process variations. Using optimal body bias results in 43% and 42% savings in leakage for predictive 70 nm and 50 nm NMOS devices, respectively. This technique also reduces the effects of die-to-die and intra-die process variations in transistor length and supply voltage by 43% and 60%, respectively, in 50 nm NMOS devices, resulting in improved yield.\",\"PeriodicalId\":355883,\"journal\":{\"name\":\"Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-08-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"115\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LPE.2003.1231846\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED '03.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LPE.2003.1231846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimal body bias selection for leakage improvement and process compensation over different technology generations
We present techniques to determine the optimal body bias (forward or reverse) to minimize leakage current and compensate process variations in scaled CMOS technologies. A circuit trades off sub-threshold leakage with band-to-band tunneling leakage at the source/drain junctions to determine the optimal substrate bias for different technology generations and under process variations. Using optimal body bias results in 43% and 42% savings in leakage for predictive 70 nm and 50 nm NMOS devices, respectively. This technique also reduces the effects of die-to-die and intra-die process variations in transistor length and supply voltage by 43% and 60%, respectively, in 50 nm NMOS devices, resulting in improved yield.