130nm以下CMOS技术泄漏控制技术的有效性和缩放趋势

B. Chatterjee, M. Sachdev, S. Hsu, R. Krishnamurthy, S. Borkar
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引用次数: 25

摘要

本文比较了深亚微米(DSM)块体CMOS技术中不同泄漏控制技术的有效性。模拟表明,每代I/sub / OFF///spl / mu/m的3-5倍/增加抵消了从技术缩放中获得的开关能量节省。我们比较了130 nm-70 nm技术中每种技术的晶体管I/sub OFF/减少和I/sub ON/退化。我们的研究结果表明,泄漏控制技术的有效性以及相关的能量与延迟权衡取决于给定技术的开关与泄漏能量的比率。我们利用我们的研究结果设计了一种用于256项64位寄存器文件(R-F)的70 nm低功耗字行驱动方案。因此,单词线驱动器的泄漏(总)能量分别减少了3/spl倍/ (2.5/spl倍/)和射频高达35%(25%)。
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Effectiveness and scaling trends of leakage control techniques for sub-130 nm CMOS technologies
This paper compares the effectiveness of different leakage control techniques in deep submicron (DSM) bulk CMOS technologies. Simulations show that the 3-5/spl times/ increase in I/sub OFF///spl mu/m per generation is offsetting the savings in switching energy obtained from technology scaling. We compare both the transistor I/sub OFF/ reduction and I/sub ON/ degradation due to each technique for the 130 nm-70 nm technologies. Our results indicate that the effectiveness of leakage control techniques and the associated energy vs. delay tradeoffs depend on the ratio of switching to leakage energies for a given technology. We use our findings to design a 70 nm low power word line driver scheme for a 256 entry, 64-bit register file (R-F). As a result, the leakage (total) energy of the word line drivers is reduced by 3/spl times/ (2.5/spl times/) and for the RF by up to 35% (25%) respectively.
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