H. Alhattab, Mahir A. Albaghdadi, Raed S. Hashim, Ali H. Ali
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引用次数: 9
摘要
利用多物理场计算流体动力学(CFD)软件包学术版COMSOL v 4.4对to -220功率晶体管微引脚翅片散热器的不同几何形状进行了建模，以增强功率晶体管的传热能力。为了比较COMSOL模型结果与实验结果，采用热电偶传感器(型号:FLUKE 87V，美国)和红外摄像机(FLIR E50)。实验结果表明，该模型具有较高的可靠性。模拟功率晶体管的装配微针翅散热器提供了高效和经济的热传递改进，与光滑散热器相比，通过建模方形，矩形和水翼型微针翅散热器降低了约11.6℃。
Design of micro heat sink for power transistor by using CFD
Different geometrical pattern of micro pin fins heat sinks for TO-220 power transistor has been modeled by using academic edition of multi-physics computational fluid dynamic (CFD) package COMSOL v 4.4 to enhance the heat transfer of power transistor. To Comparing COMSOL model results with experimental results, thermocouples sensors (type: FLUKE 87V, USA) and infrared camera (FLIR E50) were used. Experimental results showed that the model of this work has a high reliability. The assembled micro pin fins heat sinks modeled to the power transistor provides an efficient and economical improvement in thermal transferring, around 11.6oC has been reduced by modeling a heat sink with square, rectangular and hydrofoil micro pin fins compared to smooth heat sink.
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