{"title":"线性阵列并行图像处理器SliM-II","authors":"Hyunman Chang, S. Ong, M. Sunwoo","doi":"10.1109/ASAP.1997.606810","DOIUrl":null,"url":null,"abstract":"This paper describes architectures and design of a general purpose parallel image processor chip called a SliM-II Image Processor. The chip has a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives 1.92 GIPS. SIiM-II can greatly reduce the inter-PE communication overhead, due to the idea of sliding that is overlapping inter-PE communication with computation. In contrast to existing array processors, each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simultaneously in an instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel load/store between the register file and on-chip memory as in DSP chips. The bandwidth of data I/O and inter-PE communication increases due to bit-parallel paths. We developed VHDL models and performed logic synthesis using the COMPASS/sup TM/ CAD tool. We used the COMPASS/sup TM/ 3.3 V 0.6 /spl mu/m standard cell library (v8r4.9.1). The total number of transistors is about 1.5 millions. The SliM-II chip is being fabricated at the LG Semiconductor Co,, Ltd. The performance estimation shows a significant improvement for algorithms requiring multiplications compared with existing array processors.","PeriodicalId":368315,"journal":{"name":"Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A linear array parallel image processor: SliM-II\",\"authors\":\"Hyunman Chang, S. Ong, M. Sunwoo\",\"doi\":\"10.1109/ASAP.1997.606810\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes architectures and design of a general purpose parallel image processor chip called a SliM-II Image Processor. The chip has a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives 1.92 GIPS. SIiM-II can greatly reduce the inter-PE communication overhead, due to the idea of sliding that is overlapping inter-PE communication with computation. In contrast to existing array processors, each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simultaneously in an instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel load/store between the register file and on-chip memory as in DSP chips. The bandwidth of data I/O and inter-PE communication increases due to bit-parallel paths. We developed VHDL models and performed logic synthesis using the COMPASS/sup TM/ CAD tool. We used the COMPASS/sup TM/ 3.3 V 0.6 /spl mu/m standard cell library (v8r4.9.1). The total number of transistors is about 1.5 millions. The SliM-II chip is being fabricated at the LG Semiconductor Co,, Ltd. The performance estimation shows a significant improvement for algorithms requiring multiplications compared with existing array processors.\",\"PeriodicalId\":368315,\"journal\":{\"name\":\"Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-07-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASAP.1997.606810\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE International Conference on Application-Specific Systems, Architectures and Processors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASAP.1997.606810","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes architectures and design of a general purpose parallel image processor chip called a SliM-II Image Processor. The chip has a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives 1.92 GIPS. SIiM-II can greatly reduce the inter-PE communication overhead, due to the idea of sliding that is overlapping inter-PE communication with computation. In contrast to existing array processors, each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simultaneously in an instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel load/store between the register file and on-chip memory as in DSP chips. The bandwidth of data I/O and inter-PE communication increases due to bit-parallel paths. We developed VHDL models and performed logic synthesis using the COMPASS/sup TM/ CAD tool. We used the COMPASS/sup TM/ 3.3 V 0.6 /spl mu/m standard cell library (v8r4.9.1). The total number of transistors is about 1.5 millions. The SliM-II chip is being fabricated at the LG Semiconductor Co,, Ltd. The performance estimation shows a significant improvement for algorithms requiring multiplications compared with existing array processors.