{"title":"3d - ic的液体冷却","authors":"Bing Shi, Ankur Srivastava","doi":"10.1109/IGCC.2011.6008576","DOIUrl":null,"url":null,"abstract":"This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.","PeriodicalId":306876,"journal":{"name":"2011 International Green Computing Conference and Workshops","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Liquid cooling for 3D-ICs\",\"authors\":\"Bing Shi, Ankur Srivastava\",\"doi\":\"10.1109/IGCC.2011.6008576\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.\",\"PeriodicalId\":306876,\"journal\":{\"name\":\"2011 International Green Computing Conference and Workshops\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-07-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 International Green Computing Conference and Workshops\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IGCC.2011.6008576\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Green Computing Conference and Workshops","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IGCC.2011.6008576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.
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