片上系统互连体系结构的可扩展性研究

S. Suboh, Vikram K. Narayana, M. Bakhouya, T. El-Ghazawi
{"title":"片上系统互连体系结构的可扩展性研究","authors":"S. Suboh, Vikram K. Narayana, M. Bakhouya, T. El-Ghazawi","doi":"10.1109/HPCSim.2012.6266928","DOIUrl":null,"url":null,"abstract":"Network-on-Chip (NoC) architectures were proposed to solve scalability issues experienced in bus-based SoCs. They incorporate a communication infrastructure defined by topology, routers and switches, in order to provide a scalable and high performance network for the SoC resources while satisfying the constraints of embedded platforms. The choice of appropriate NoC topology depends on the desired network size for the required performance. Simulation of NoCs based on real application traffic is time consuming, and therefore not a feasible approach for rapid design space exploration. In this paper, a methodology to study the scalability of three on-chip interconnect architectures, WK-recursive, Mesh and Spidergon, is presented. Simulation results are presented for different cases, demonstrating the potential of our approach for selecting the most scalable on-chip interconnect architecture.","PeriodicalId":428764,"journal":{"name":"2012 International Conference on High Performance Computing & Simulation (HPCS)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A scalability study of interconnect architectures for System-on-Chip\",\"authors\":\"S. Suboh, Vikram K. Narayana, M. Bakhouya, T. El-Ghazawi\",\"doi\":\"10.1109/HPCSim.2012.6266928\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Network-on-Chip (NoC) architectures were proposed to solve scalability issues experienced in bus-based SoCs. They incorporate a communication infrastructure defined by topology, routers and switches, in order to provide a scalable and high performance network for the SoC resources while satisfying the constraints of embedded platforms. The choice of appropriate NoC topology depends on the desired network size for the required performance. Simulation of NoCs based on real application traffic is time consuming, and therefore not a feasible approach for rapid design space exploration. In this paper, a methodology to study the scalability of three on-chip interconnect architectures, WK-recursive, Mesh and Spidergon, is presented. Simulation results are presented for different cases, demonstrating the potential of our approach for selecting the most scalable on-chip interconnect architecture.\",\"PeriodicalId\":428764,\"journal\":{\"name\":\"2012 International Conference on High Performance Computing & Simulation (HPCS)\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 International Conference on High Performance Computing & Simulation (HPCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HPCSim.2012.6266928\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Conference on High Performance Computing & Simulation (HPCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPCSim.2012.6266928","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

片上网络(NoC)架构是为了解决基于总线的soc的可扩展性问题而提出的。它们结合了由拓扑、路由器和交换机定义的通信基础设施,以便为SoC资源提供可扩展和高性能的网络,同时满足嵌入式平台的限制。选择合适的NoC拓扑取决于所需性能所需的网络大小。基于实际应用流量的noc仿真非常耗时,因此不是快速设计空间探索的可行方法。本文提出了一种研究三种片上互连架构(WK-recursive、Mesh和Spidergon)可扩展性的方法。针对不同的情况给出了仿真结果,证明了我们的方法在选择最具可扩展性的片上互连架构方面的潜力。
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A scalability study of interconnect architectures for System-on-Chip
Network-on-Chip (NoC) architectures were proposed to solve scalability issues experienced in bus-based SoCs. They incorporate a communication infrastructure defined by topology, routers and switches, in order to provide a scalable and high performance network for the SoC resources while satisfying the constraints of embedded platforms. The choice of appropriate NoC topology depends on the desired network size for the required performance. Simulation of NoCs based on real application traffic is time consuming, and therefore not a feasible approach for rapid design space exploration. In this paper, a methodology to study the scalability of three on-chip interconnect architectures, WK-recursive, Mesh and Spidergon, is presented. Simulation results are presented for different cases, demonstrating the potential of our approach for selecting the most scalable on-chip interconnect architecture.
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