基于低功耗FinFET的10T SRAM单元

Navneet Kaur, N. Gupta, Hitesh Pahuja, Balwinder Singh, S. Panday
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引用次数: 10

摘要

在今天的片上系统中,内存占据了70%以上的面积,并且在未来几年将继续增加。随着技术规模的扩大,MOSFET面临各种挑战,导致泄漏增加。在32nm以下的技术中,FinFET由于减少了短通道效应,是最有前途的批量CMOS技术替代品。采用16nm工艺节点的MOSFET、FinFET设计了10T SRAM单元,并与传统的6T SRAM单元进行了功率、延迟、功率延迟积(PDP)、泄漏电流和静态噪声裕度(SNM)等性能参数的比较。
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Low Power FinFET based 10T SRAM cell
Memory occupies more than 70 percent of area in today's system on chip and the trends continue to be increases in coming years. As the technology is scaling the bulk MOSFET faces various challenges which lead to increased leakage. Below 32nm technology, FinFET is the most promising substitute to bulk CMOS technology because of reduced short channel effect. The proposed 10T SRAM cell is designed using MOSFET, FinFET at 16nm technology node and its performance parameters such as power, delay, Power Delay Product (PDP), leakage current and Static Noise Margin (SNM) are compared with conventional 6T SRAM cell.
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