损耗介质中高速互连的物理一致传输线模型

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967656

K. Coperich, Jason Money, Andreas C. Cangellark, A. Ruehli

{"title":"损耗介质中高速互连的物理一致传输线模型","authors":"K. Coperich, Jason Money, Andreas C. Cangellark, A. Ruehli","doi":"10.1109/EPEP.2001.967656","DOIUrl":null,"url":null,"abstract":"The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"299 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"66","resultStr":"{\"title\":\"Physically consistent transmission line models for high-speed interconnects in lossy dielectrics\",\"authors\":\"K. Coperich, Jason Money, Andreas C. Cangellark, A. Ruehli\",\"doi\":\"10.1109/EPEP.2001.967656\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"299 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"66\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967656\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967656","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 66

摘要

提出了一种用于损耗色散介质中高速互连的物理一致的多导体传输线模型。在此基础上，提出了一种考虑介电损耗和色散的spice兼容等效电路的构造方法。

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Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

The development of a physically consistent multi-conductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is proposed for the construction of SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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