基于分层模块聚类的模拟放置

Mark Po-Hung Lin, Shyh-Chang Lin
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引用次数: 40

摘要

在模拟布线设计中,减小寄生耦合效应,提高电路性能是非常重要的。因此,最重要的设备级放置约束是匹配、对称和接近。然而,许多以前的作品分别处理这些约束,没有一个提到如何同时和分层地处理不同的约束。在本文中,我们首先给出一个案例研究来说明以分层方式集成这些约束的必要性。然后,我们提出了第一个基于分层模块聚类的模拟放置公式。我们的方法可以处理各种约束组的模拟放置,包括匹配、(分层)对称和(分层)接近组。据我们所知,这也是文献中第一个使用基于B*树表示的聚类约束处理地板规划的工作。基于工业模拟设计的实验结果表明,该方法是非常有效的。
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Analog placement based on hierarchical module clustering
In analog layout design, it is very important to reduce the parasitic coupling effects and improve the circuit performance. Consequently, the most important device-level placement constraints are matching, symmetry, and proximity. However, many previous works deal with these constraints separately, and none of them mention how to handle different constraints simultaneously and hierarchically. In this paper, we first give a case study to show the needs of integrating these constraints in a hierarchical manner. Then, we present the first formulation for analog placement based on hierarchical module clustering. Our approach can handle analog placement with various constraint groups including matching, (hierarchical) symmetry, and (hierarchical) proximity groups. To our best knowledge, this is also the first work in the literature to handle floorplanning with the clustering constraint using the B*-tree based representation. Experimental results based on industrial analog designs show that our approach is very effective and efficient.
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