Zhenghui Wu, Xiaojin Fan, Jie Zhao, Feng Deng, Hechun Zhang, Gang Chen, Hongmei Liu, Jiajun Zhang, Jun Zhang, Min Wu, Yuyang Xia, Chris Du, Chao Zhou, Feng Jiang, Jialiang Xu, Dan Liu, Carrie Chen, Candy He, Sean Kuo, Liwen Guo, Jiahong Wu, Tzuchun Hung, Minghua Duan, Lianjun Zhao, Chiming Jao, Vinson Lin, R. Yuan
{"title":"一种新的ITS RSCU扩展温度边缘服务器系统架构与设计","authors":"Zhenghui Wu, Xiaojin Fan, Jie Zhao, Feng Deng, Hechun Zhang, Gang Chen, Hongmei Liu, Jiajun Zhang, Jun Zhang, Min Wu, Yuyang Xia, Chris Du, Chao Zhou, Feng Jiang, Jialiang Xu, Dan Liu, Carrie Chen, Candy He, Sean Kuo, Liwen Guo, Jiahong Wu, Tzuchun Hung, Minghua Duan, Lianjun Zhao, Chiming Jao, Vinson Lin, R. Yuan","doi":"10.1109/ITherm45881.2020.9190230","DOIUrl":null,"url":null,"abstract":"Along with quickly emerging applications, including 5G, IOT (Internet of Things), Auto Piloting, etc., in industry, demands for local large-scale data analysis and AI (Artificial Intelligence) processing on edge is growing rapidly. As a result, hardware power consumption for edge computing is increasing fast. At the same time, high-power edge computing products are supposed to fit into non-data center scenarios such as 5G edge network, Roads Side Control Unit (RSCU), smart factory, etc. This paper introduces a typical edge server, investigates the environmental requirements for non-data center scenarios and studies on technical feasibility of further extending working temperature, dustproof, waterproof, anti-condensation, etc., and proposed a completed, environmental reliable solution for edge hardware products. The proposed Cloud Edge Server also extends AI server products and environmental adaptability on edge. The same PCB (Printed Circuit Board) can support flexible AI hardware accelerators and storage configurations for diverse applications. And, it can fit into different outdoor and indoor scenarios with only changing chassis design which helps dramatically reducing total deployment cost and achieve better ROI (Return on Investment).","PeriodicalId":193052,"journal":{"name":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Novel Extended Temperature Edge Server System Architecture and Design for ITS RSCU\",\"authors\":\"Zhenghui Wu, Xiaojin Fan, Jie Zhao, Feng Deng, Hechun Zhang, Gang Chen, Hongmei Liu, Jiajun Zhang, Jun Zhang, Min Wu, Yuyang Xia, Chris Du, Chao Zhou, Feng Jiang, Jialiang Xu, Dan Liu, Carrie Chen, Candy He, Sean Kuo, Liwen Guo, Jiahong Wu, Tzuchun Hung, Minghua Duan, Lianjun Zhao, Chiming Jao, Vinson Lin, R. Yuan\",\"doi\":\"10.1109/ITherm45881.2020.9190230\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Along with quickly emerging applications, including 5G, IOT (Internet of Things), Auto Piloting, etc., in industry, demands for local large-scale data analysis and AI (Artificial Intelligence) processing on edge is growing rapidly. As a result, hardware power consumption for edge computing is increasing fast. At the same time, high-power edge computing products are supposed to fit into non-data center scenarios such as 5G edge network, Roads Side Control Unit (RSCU), smart factory, etc. This paper introduces a typical edge server, investigates the environmental requirements for non-data center scenarios and studies on technical feasibility of further extending working temperature, dustproof, waterproof, anti-condensation, etc., and proposed a completed, environmental reliable solution for edge hardware products. The proposed Cloud Edge Server also extends AI server products and environmental adaptability on edge. The same PCB (Printed Circuit Board) can support flexible AI hardware accelerators and storage configurations for diverse applications. And, it can fit into different outdoor and indoor scenarios with only changing chassis design which helps dramatically reducing total deployment cost and achieve better ROI (Return on Investment).\",\"PeriodicalId\":193052,\"journal\":{\"name\":\"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITherm45881.2020.9190230\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITherm45881.2020.9190230","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Novel Extended Temperature Edge Server System Architecture and Design for ITS RSCU
Along with quickly emerging applications, including 5G, IOT (Internet of Things), Auto Piloting, etc., in industry, demands for local large-scale data analysis and AI (Artificial Intelligence) processing on edge is growing rapidly. As a result, hardware power consumption for edge computing is increasing fast. At the same time, high-power edge computing products are supposed to fit into non-data center scenarios such as 5G edge network, Roads Side Control Unit (RSCU), smart factory, etc. This paper introduces a typical edge server, investigates the environmental requirements for non-data center scenarios and studies on technical feasibility of further extending working temperature, dustproof, waterproof, anti-condensation, etc., and proposed a completed, environmental reliable solution for edge hardware products. The proposed Cloud Edge Server also extends AI server products and environmental adaptability on edge. The same PCB (Printed Circuit Board) can support flexible AI hardware accelerators and storage configurations for diverse applications. And, it can fit into different outdoor and indoor scenarios with only changing chassis design which helps dramatically reducing total deployment cost and achieve better ROI (Return on Investment).