{"title":"多芯片模块封装的技术问题","authors":"B. Mcwilliams, J. Demmin","doi":"10.1109/NTC.1992.267914","DOIUrl":null,"url":null,"abstract":"It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed.<<ETX>>","PeriodicalId":448154,"journal":{"name":"[Proceedings] NTC-92: National Telesystems Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Technical issues with multichip module packaging\",\"authors\":\"B. Mcwilliams, J. Demmin\",\"doi\":\"10.1109/NTC.1992.267914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed.<<ETX>>\",\"PeriodicalId\":448154,\"journal\":{\"name\":\"[Proceedings] NTC-92: National Telesystems Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-05-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[Proceedings] NTC-92: National Telesystems Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NTC.1992.267914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[Proceedings] NTC-92: National Telesystems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NTC.1992.267914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed.<>
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