一个基于时序驱动模块的芯片设计流程

F. Mo, R. Brayton
{"title":"一个基于时序驱动模块的芯片设计流程","authors":"F. Mo, R. Brayton","doi":"10.1145/996566.996585","DOIUrl":null,"url":null,"abstract":"A Module-Based design flow for digital ICs with hard and soft modules is presented. Versions of the soft modules are implemented with different area/delay characteristics. The versions represent flexibility that can he used in the physical design to meet timing requirements. The flow aims at minimizing the clobk cycle of the chip while providing quicker turn-around time. Unreliable wiring estimation is eliminated and costly iterations are reduced resulting in substantial reductions in tun time as well as a significant decrease in the clock periods.","PeriodicalId":115059,"journal":{"name":"Proceedings. 41st Design Automation Conference, 2004.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A timing-driven module-based chip design flow\",\"authors\":\"F. Mo, R. Brayton\",\"doi\":\"10.1145/996566.996585\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Module-Based design flow for digital ICs with hard and soft modules is presented. Versions of the soft modules are implemented with different area/delay characteristics. The versions represent flexibility that can he used in the physical design to meet timing requirements. The flow aims at minimizing the clobk cycle of the chip while providing quicker turn-around time. Unreliable wiring estimation is eliminated and costly iterations are reduced resulting in substantial reductions in tun time as well as a significant decrease in the clock periods.\",\"PeriodicalId\":115059,\"journal\":{\"name\":\"Proceedings. 41st Design Automation Conference, 2004.\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 41st Design Automation Conference, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/996566.996585\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 41st Design Automation Conference, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/996566.996585","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

提出了一种基于模块的数字集成电路软、硬模块设计流程。不同版本的软模块具有不同的区域/延迟特性。这些版本代表了可以在物理设计中使用的灵活性,以满足时间要求。该流程旨在最大限度地减少芯片的时钟周期,同时提供更快的周转时间。消除了不可靠的布线估计,减少了昂贵的迭代,从而大大减少了周转时间和时钟周期。
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A timing-driven module-based chip design flow
A Module-Based design flow for digital ICs with hard and soft modules is presented. Versions of the soft modules are implemented with different area/delay characteristics. The versions represent flexibility that can he used in the physical design to meet timing requirements. The flow aims at minimizing the clobk cycle of the chip while providing quicker turn-around time. Unreliable wiring estimation is eliminated and costly iterations are reduced resulting in substantial reductions in tun time as well as a significant decrease in the clock periods.
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