极紫外光膜成像性能研究进展

O. Romanets, K. Ricken, M. Kupers, F. Wählisch, C. Piliego, P. Broman, D. de Graaf
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引用次数: 2

摘要

膜的目的是保护网纹不受颗粒污染,从而减少缺陷的数量,提高产量。在本文中,我们展示了薄膜技术的最新进展如何成功地解决了用EUV薄膜成像的主要挑战。我们使用扫描仪成像测试、EUV反射率测量和寿命测试的最新结果来证明这一点。薄膜的极紫外光反射率是过去对薄膜成像产生负面影响的因素之一。从膜反射的光导致拐角和边缘的邻近区域过度曝光。对采用新工艺生产的薄膜进行的测试表明,EUV反射率在0.04%的范围内,并且测量了多个薄膜在0.15nm以下的角落对临界尺寸的影响。通过在薄膜上暴露多达3000片晶圆来测试寿命性能,同时定期评估成像指标的稳定性。岩性研究包括:临界尺寸(CD)和临界尺寸均匀性(CDU),以及对比度(通过线宽粗糙度)。DoseMapper是为提高CDU而开发的EUV扫描仪应用程序,用于寿命测试。在这里,我们表明它可以成功地减少薄膜诱导的CDU和CDU的寿命(以前显示由薄膜EUV传输漂移主导)。我们使用DoseMapper的结果表明,虽然场内CDU 3sigma随着使用寿命的增加而增加,但使用DoseMapper时,它保持在1.1nm NXE3400 ATP规格内。
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Progress in imaging performance with EUV pellicles
The purpose of pellicles is to protect reticles from particle contamination, thus reducing the number of defects and increasing yield. In this paper we show how recent progress in pellicle technology has succeeded in solving the main challenges in imaging with EUV pellicles. We demonstrate this using the recent results of imaging tests in scanner, EUV reflectivity measurements, and lifetime testing. EUV light reflectivity of pellicles is one of the effects that have negatively impacted imaging with pellicles in the past. Light reflected from pellicles leads to the overexposure of neighboring fields in the corners and edges. Tests with pellicles produced using a new process show EUV reflectivity within specification of 0.04%, and measured impact on critical dimension in the corners below 0.15nm for multiple pellicles. Lifetime performance was tested by exposing up to 3000 wafers with a pellicle while periodically assessing the stability of imaging metrics. The lithometrics studies include: critical dimension (CD) and critical dimension uniformity (CDU), and contrast (via line width roughness). DoseMapper, which is an EUV scanner application developed to improve CDU, was applied during the lifetime test. Here we show that it can successfully reduce the pellicle-induced CDU and CDU over lifetime (previously shown to be dominated by pellicle EUV transmission drift). Our results using DoseMapper show that whilst intrafield CDU 3sigma increases over lifetime, it stays comfortably within the 1.1nm NXE3400 ATP specification using DoseMapper.
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