{"title":"定义芯片密封表面裂纹扩展","authors":"D. Brown","doi":"10.1201/9780429264702-25","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":169380,"journal":{"name":"Pavement and Asset Management","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Defining crack growth on chipseal surfaces\",\"authors\":\"D. Brown\",\"doi\":\"10.1201/9780429264702-25\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":169380,\"journal\":{\"name\":\"Pavement and Asset Management\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-02-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Pavement and Asset Management\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1201/9780429264702-25\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Pavement and Asset Management","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1201/9780429264702-25","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}