K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala
{"title":"面向射频单包系统应用的多层封装平面天线的研制","authors":"K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala","doi":"10.1109/EPEP.2001.967621","DOIUrl":null,"url":null,"abstract":"The integration of an antenna with an RF module is an attractive solution for realizing a small size and low cost wireless transceiver. Multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fired ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":"{\"title\":\"Development of planar antennas in multi-layer packages for RF-system-on-a-package applications\",\"authors\":\"K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala\",\"doi\":\"10.1109/EPEP.2001.967621\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The integration of an antenna with an RF module is an attractive solution for realizing a small size and low cost wireless transceiver. Multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fired ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"29\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967621\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967621","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of planar antennas in multi-layer packages for RF-system-on-a-package applications
The integration of an antenna with an RF module is an attractive solution for realizing a small size and low cost wireless transceiver. Multi-layer planar antennas for system-on-a-package (SOP) application are presented. Two different types of antennas for the low temperature co-fired ceramic (LTCC) package and the multi-layer organic (MLO) package are developed. For the LTCC package, the cavity-backed patch antenna has been developed, in order to increase bandwidth and to reduce the size of the ground plane. A via feed is used for direct connection with other RF blocks. For the cavity backed patch antenna, bandwidth is increased by 20% and real estate including ground plane is reduced by 50%, compared to the conventional patch antenna. For the MLO package, a lifted slot antenna has been developed. In order to reduce loss at feeding point and to minimize pattern distortion, via feed has been used. The antenna has been designed at 5.8 GHz and has gain of 3.7 dBi and bandwidth of 14%.
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