{"title":"快速树脂模具嵌入薄膜压力/温度传感器","authors":"R. Luo, C. Lin, C. Chen, Y.S. Chen","doi":"10.1109/IECON.1999.819399","DOIUrl":null,"url":null,"abstract":"In this paper we have developed a new approach by embedding sensors into rapid resin mold's core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials.","PeriodicalId":378710,"journal":{"name":"IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)","volume":"341 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Rapid resin mold with embedded thin film pressure/temperature sensors\",\"authors\":\"R. Luo, C. Lin, C. Chen, Y.S. Chen\",\"doi\":\"10.1109/IECON.1999.819399\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we have developed a new approach by embedding sensors into rapid resin mold's core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials.\",\"PeriodicalId\":378710,\"journal\":{\"name\":\"IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)\",\"volume\":\"341 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IECON.1999.819399\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IECON.1999.819399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Rapid resin mold with embedded thin film pressure/temperature sensors
In this paper we have developed a new approach by embedding sensors into rapid resin mold's core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials.
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