带地平面电流预计算的平面封装电感提取

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967650

G. Lippens, D. De Zutter

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引用次数: 1

摘要

提出了一种基于几何和频率的大引脚数平面封装接地电流预计算方法。我们使用这种预计算来构建一个自适应非正交PEEC网格，以便在最小的地平面离散的情况下正确建模射频封装的电感行为。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Flat package inductance extraction with ground plane current precalculation

A method is presented in which a geometry and frequency dependent precalculation of large pin count flat package ground plane currents is made. We use this precalculation to construct an adaptive non-orthogonal PEEC grid for correct modeling of inductance behaviour of RF packages with minimal ground plane discretisations needed.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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