Opto-electronies packaging technology for the last 1 m

ASET's R&D efforts on opto-electronics packaging technology for terabit throughput are reviewed. To establish opto-electronics packaging technologies for high-speed routers and information appliances, we have been researching the following areas; an OE-MCM (Opto-Electronic Multi Chip Module) for low-cost high-speed processing, an AIP (Active-Interposer) for LSIs that increases bit rate (>1.25 Gbps) and makes for a smaller interface with optical signals, and an OE-board with optical right-angled multi-channel connectors for three-dimensional board-level assembly structures. We will demonstrate the following packaging technologies: ( 1 ) Optical waveguide film lamination technique: This technique is versatile and reduces the cost of the OE-MCM. The waveguide film has a 0.3-0.5 dB/c:m loss and is laminated on the printed circuit board. (2) AIP: The driver and receiver ICs, photo diode and laser diode are three-dimensionally stacked and integrated. (3) Self-written Waveguide: The waveguide exploits a unique automatic fiber-coupling method. Optical coupling is complete even if there is a few dozen of microns miss-alignment between fibers. (4) SMOP (Small MultdDemultiplexer consisting of Optical Elements): This is a compact MultVDemultiplexer for four-wavelength CWDM (Coarse Wavelength Division Multiplexing) of the same dimension as the MT ferrule. ( 5 ) Opto-electronic Subrack: This device consists of an optical backplane, fiber bending right-angled multi-channel connectors, optical boards and OE-MCMs. This work was performed under the management of ASET and was supported by NED0 (New Energy and industrial technology Development Organization)