热载流子对具有LOCOS特征的横向dmos的影响评估

A. Houadef, B. Djezzar
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引用次数: 2

摘要

利用TCAD仿真计算了横向扩散MOSFET (LDMOS)的热载流子应力。被测器件是在CDTA提供的1 μ m CMOS流下通过工艺模拟获得的。n型晶体管使用LOCOS(硅的局部氧化)和单个RESURF(减少表面场)特征。利用陷阱退化模型,提取了阈值电压VTH、导通电阻RON、饱和电流IDsat和器件寿命随时间和不同偏差的位移。我们发现这些变化是可控的,它们有一个单一的过程机制,在我们的例子中是由热电子引起的。但是,在相同应力下的闪烁噪声评估显示出明显的不稳定性。
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Evaluation of Hot Carrier Impact on Lateral-DMOS with LOCOS feature
Hot carrier stress is evaluated on a laterally diffused MOSFET (LDMOS) by TCAD simulation. The device under test is obtained from process simulation under a 1µm CMOS flow available at CDTA. The n-type transistor uses the LOCOS (local oxidation of silicon) and single RESURF (reduced surface field) features. Using the trap degradation model, degradation over time and different biases, the shift of threshold voltage VTH, ON-state resistance RON, saturation current IDsat, and device lifetime are extracted. The shifts were found to be manageable, they have a single process mechanism and are due to hot electrons in our case. But, flicker noise assessment under the same stress shows noticeable instabilities.
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