羟基磷灰石(HA)和三磷酸钙(TCP)在环氧树脂基封口剂中的掺入

A. Al-Quraini, Abdulrahman Fahad Al-Aodah, Adam Ahmed M. Al-Qadhi, Abdul Majeed Munir Ahmad
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摘要

摘要目的本研究旨在评估和比较羟基磷灰石(HA)和磷酸三钙(TCP)纳米颗粒对市售环氧树脂基密封剂的影响,重点研究孔隙率和推出粘结强度。材料与方法本研究分为对照组和两个实验组。在每个实验组中,密封剂与2.5 wt混合。%的HA和TCP纳米颗粒。使用30颗拔除的单根牙。切完牙冠后,使用K3旋转系统,使用剩余的15颗牙的牙根,最高可达40 ~ 0.06。用3ml 17% EDTA涂抹60秒,去除涂抹层。然后用3 mL 2.25% NaOCl和5 mL蒸馏水冲洗管。通过Instron万能试验机在封闭管上获取的2mm截面上测试推出键的强度。数据采用单因素方差分析(one-way ANOVA)进行评估,事后检验的显著性水平为p 0.05,当三组在空隙体积和粘合强度方面进行交叉检查时,结果很明显。Micro-CT评估显示,HA组的最小空洞体积为0.1152 mm3(2.69%),而对照组为0.1818 mm3 (3.9%), TCP组为0.2194 mm3(4.33%)。1组(对照组)的平均粘结强度为4.18±1.77 MPa, 2组(HA 2.5%)的平均粘结强度为4.19±1.54 MPa, 3组(TCP 2.5%)的平均粘结强度为3.76±1.95 MPa。1、3组为黏结型和混合型破坏,2组为黏结型和混合型破坏。结论在研究范围内,在AH Plus中加入2.5%的HA和TCP纳米颗粒对空隙体积百分比和结合强度没有显著的负面影响。
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Incorporation of Hydroxyapatite (HA) and Calcium Triphosphate (TCP) in the Epoxy Resin-Based Sealer
Abstract Objective This study aims to assess and compare the influence of hydroxyapatite (HA) and tricalcium phosphate (TCP) nanoparticles on a commercially available epoxy resinbased sealer, focusing on porosity and push-out bond strength. Materials and Methods This work was classified into a control group and two experimental groups. In each experimental group, the sealer was mixed with 2.5 wt.% of HA and TCP nanoparticles. Thirty extracted single-rooted teeth were utilized. After sectioning the crowns, the remaining roots of 15 teeth were used, up to 40 to 0.06, using a K3 rotary system. Smear layers were removed with 3 mL of 17% EDTA applied for 60 seconds. Then, the canals were irrigated with 3 mL of 2.25% NaOCl and 5 mL of distilled water. The strength of push-out bonds was tested via an Instron universal testing machine on a 2 mm section acquired from obturated canals. Data were assessed using one-way ANOVA and post hoc tests at a significance level of p < 0.05. Results A nonsignificant difference (p > 0.05) was evident when the three groups were crosschecked in terms of void volume and bond strength. Micro-CT evaluations revealed the lowest volume of voids to be 0.1152 mm3 (2.69%) for the HA group compared with the control group 0.1818 mm3 (3.9%) and the TCP group 0.2194 mm3 (4.33%). Mean bond strength values were 4.18 ± 1.77 MPa for group 1 (control), 4.19 ± 1.54 MPa for group 2 (HA 2.5%) and 3.76 ± 1.95 MPa for group 3 (TCP 2.5%). Groups 1 and 3 showed both cohesive and a mixed type of failure, while group 2 showed adhesive and a mixed type of bond failure. Conclusion Within the limitations of the study, incorporation of 2.5 wt% HA and TCP nanoparticles into AH Plus did not significantly affect the percentage volume of voids and the bond strength negatively.
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