{"title":"分离式电源平面下信号线反射与地面反弹的复合效应","authors":"Sheng-Mou Lin, R. Wu","doi":"10.1109/EPEP.2001.967618","DOIUrl":null,"url":null,"abstract":"The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. A new equivalent circuit model is proposed and simulations are performed for a three-layer structure to characterize ground bounce coupling.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"24","resultStr":"{\"title\":\"Composite effects of reflections and ground bounce for signal line through a split power plane\",\"authors\":\"Sheng-Mou Lin, R. Wu\",\"doi\":\"10.1109/EPEP.2001.967618\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. A new equivalent circuit model is proposed and simulations are performed for a three-layer structure to characterize ground bounce coupling.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"24\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967618\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967618","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Composite effects of reflections and ground bounce for signal line through a split power plane
The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in signal return path and ground bounce between power/ground planes. A new equivalent circuit model is proposed and simulations are performed for a three-layer structure to characterize ground bounce coupling.