肖特基栅AlGaN/GaN HEMT器件直流响应的高温特性分析模型

Yun-Hsiang Wang, Yung C. Liang, G. Samudra, Ting-Fu Chang, Chih-Fang Huang, Li Yuan, G. Lo
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引用次数: 2

摘要

本文报道了AlGaN/GaN高电子迁移率晶体管(HEMTs)器件特性的分析建模和温度依赖性分析。为了正确预测各种高温(300K~500K)条件下栅极肖特基势垒高度(ΦB)、导带能费米能级(EC-EF)、二维电子气(2DEG)片密度、栅极阈值(Vth)和亚阈值电压(ID-VG)以及漏极电流-电压(ID-VD)特性,本研究提出了一种基于物理的模型。然后,通过与实验室测量结果以及从Sentaurus TCAD模拟中获得的数值结果进行比较,验证了分析结果。该模型可以帮助电力电子器件设计人员预测高温下AlGaN/GaN HEMT器件的性能,而无需使用复杂的定制计算机编码的大量数值求解过程。
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Analytical modelling of high temperature characteristics on the DC responses for Schottky-gate AlGaN/GaN HEMT devices
This paper reports analytical modelling and analysis of the temperature dependence on the device characteristics of the AlGaN/GaN high electron mobility transistors (HEMTs). A physics-based model is proposed in this study in order to correctly predict the gate Schottky barrier height (ΦB), Fermi-level from conduction band energy (EC-EF), two-dimensional electron gas (2DEG) sheet density, gate threshold (Vth) and sub-threshold voltages (ID-VG), and drain current-voltage (ID-VD) characteristics under various high temperature (300K~500K) conditions. The analytical results are then verified by comparing with the laboratory measurement as well as the numerical results obtained from the Sentaurus TCAD simulation. The proposed model is found to be useful for power electronic device designers on the prediction of the AlGaN/GaN HEMT device performance under high temperature operation without the use of heavy numerical solving process that requires complicated customized computer coding.
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