BiCMOS混合模式集成电路中的信号隔离

K. Joardar
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引用次数: 35

摘要

利用二维器件模拟和硅上的测量比较了几种串扰抑制方案,结果表明,基于SOI的工艺可以提供高的串扰隔离,而全结隔离井可以以更低的成本提供相同或更好的串扰抗扰性。简单的保护环衬底触点似乎是最适合在高工作频率下防止串扰的技术。我们还开发了一个集总参数等效电路来模拟SPICE中的全结隔离井。
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Signal isolation in BiCMOS mixed mode integrated circuits
Comparing several cross-talk reduction schemes using two-dimensional device simulation and measurements on silicon has shown that while SOI based processes provide high isolation from cross-talk, fully junction isolated wells can provide equal or better cross-talk immunity at a lesser expense. Simple guard ring substrate contacts appear to be the technique best suited for preventing cross-talk at high operating frequencies. A lumped parameter equivalent circuit has also been developed to simulate fully junction isolated wells in SPICE.
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