利用损伤前体预测热循环平均温度对SAC305无铅可靠性的影响

P. Lall, Kazi Mirza
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引用次数: 6

摘要

汽车引擎盖下应用中的电子器件可能会受到150°C至175°C的温度影响。车道偏离预警系统、防撞系统等电子功能对车辆运行至关重要。先前的研究表明,低银无铅SnAgCu合金即使短时间暴露在高温下,其机械性能也会明显恶化。目前二级互连的寿命预测模型没有提供一种快速评估平均温度对循环寿命影响的方法。本文提出了一种基于相生长速率和金属间厚度等物理损伤指标的平均循环温度对热疲劳可靠性影响的评价方法。由于现场应用中热剖面的量化通常非常困难,因此所提出的方法不需要获取热剖面历史。研究了-50°C ~ +50°C、0°C ~ 100°C、50°C ~ 150°C三种相同热偏移和不同平均温度的环境。测试组件与三种不同的封装,包括CABGA 144, PBGA 324,和PBGA 676已用于研究。在此基础上推导了三个热循环的损伤-代理-等效关系。利用威布尔分布分析了三种试验装置的平均循环温度对热疲劳寿命的影响。数据表明,即使热偏移量一定,热疲劳系数也随热循环平均温度的升高而降低。损伤等效模型预测了热循环平均温度对威布尔寿命分布的影响。基于损伤代理的损伤等效方法与实验数据具有较好的相关性。
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Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors
Electronics in automotive underhood applications may be subjected to temperatures in the neighborhood of 150°C to 175°C. Several electronic functions such as lane departure warning systems, collision avoidance systems are critical to vehicle operation. Prior studies have shown that low silver leadfree SnAgCu alloys exhibit pronounced deterioration in mechanical properties even after short exposure to high temperatures. Current life prediction models for second level interconnects do not provide a method for quick-turn assessment of the effect of mean temperature on cyclic life. In this paper, a method has been developed for assessment of the effect of mean cyclic temperature on the thermal fatigue reliability based on physics based leading damage indicators including phase-growth rate and the intermetallic thickness. Since the quantification of the thermal profile in the field applications may be often very difficult, the proposed method does not require the acquisition of the thermal profile history. Three environments of -50°C to +50°C, 0°C to 100°C, 50°C to 150°C with identical thermal excursion and different mean temperatures have been studied. Test assemblies with three different packages including CABGA 144, PBGA 324, and PBGA 676 have been used for the study. Damage-proxy based damage-equivalency relationships have been derived for the three thermal cycles. Weibull distributions have been developed for the three test assemblies to evaluate the effect of the mean cyclic temperature on the thermal fatigue life. Data indicates that the thermal fatigue lie drops with the increase in mean temperature of the thermal cycle even if the thermal excursion magnitude is kept constant. Damage equivalency model predictions of the effect of mean temperature of the thermal cycle have been validated versus weibull life distributions. The damage proxy based damage equivalency methodology shows good correlation with experimental data.
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