神经网络的光子实现

B. K. Jenkins, A. Tanguay
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引用次数: 11

摘要

有几大类神经网络由分布的、非线性的、动态的系统组成,在这些系统中,大量相对简单的处理元素(神经元单元)紧密相连。互连通常被配置为使互连权值是自适应的,并且包含系统的学习记忆和行为。先进的光学互连技术正在开发中,可以潜在地与光电神经元单元结合使用,以实现具有相对较大阵列尺寸(105至106个神经元单元)和高度连接性(扇形输出和扇形输入为104至106,总互连为109至1012)的光子神经类计算模块(例如,图1)。一个关键的开放问题是,混合光电空间光调制器(slm)的高带宽(可能是100 MHz或更多)是否可以有效地与这种高密度体全息光学互连(在光折变材料中动态记录)相结合,以提供增强的计算吞吐量和复杂的神经网络模拟能力。第二个关键的开放问题是,先进的电子/光子封装技术是否能够提供高度紧凑的多芯片模块的系统级集成能力,这些模块既表现出局部(多平面),也表现出全局互连(图2)。
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Photonic Implementations of Neural Networks
Several broad classes of neural networks comprise distributed, nonlinear, dynamical systems in which large numbers of relatively simple processing elements (neuron units) are densely interconnected. The interconnections are often configured such that the interconnection weights are adaptive and contain the learned memories and behaviors of the system. Advanced optical interconnection techniques are being developed that can potentially be used in conjunction with optoelectronic neuron units to implement photonic neural-like computational modules (e.g., Fig. 1) with relatively large array sizes (105 to 106 neuron units) and a high degree of connectivity (fan-outs and fan-ins of 104 to 106, with 109 to 1012 total interconnections). A key open question is whether the high bandwidths (potentially 100 MHz or more) available from hybrid optoelectronic spatial light modulators (SLMs) can be effectively combined with such high density volume holographic optical interconnections (dynamically recorded in photorefractive materials) to provide enhanced computational throughput capacity as well as complex neural network simulation capability. A second key open question is whether advanced electronic/photonic packaging technologies can provide capability for system-level integration of highly compact multichip modules that exhibit both local (multi-plane) and global interconnections (Fig. 2).
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