通用系统级建模和优化超越CMOS器件应用

V. Huang, C. Pan, A. Naeemi
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摘要

在这项工作中,为未来设备提出了一种快速,通用的系统级设计和优化方法。本研究从性能和能量延迟积(EDP)方面对GaN异质结TFET、WTe2二维异质结间层TFET (ThinTFET)和WTe2过渡金属二硫化物TFET (TMD TFET)进行了评价。本研究探讨装置级性能对系统级性能及功耗的影响。系统级方法使用一种通用模型,该模型利用随机线分布来估计系统性能。在不同的功率预算约束下,使用经验CPI模型检查每个器件的最佳电源电压和栅极计数以实现最大吞吐量。在此基础上,论证了各种超cmos器件技术的优化设计,以提高EDP。这项工作的结果描述了给定功率预算范围内的最佳EDP,并提供了关键设计参数的深刻趋势,以及基于早期设计阶段快速系统级优化的最佳性能和功率指标。
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Generic system-level modeling and optimization for beyond CMOS device applications
In this work, a fast, generic system-level design and optimization methodology is presented for futuristic devices. This work evaluates GaN Heterojunction TFET, WTe2 Two-dimensional heterojunction interlayer TFET (ThinTFET), and WTe2 Transition Metal Dichalcogenide TFET (TMD TFET) in terms of performance and energy-delay product (EDP). This study investigates the impact of device-level performance on the system-level performance and power dissipation. The system-level methodology uses a generic model that utilizes a stochastic wire distribution to estimate system performance. An optimum supply voltage and gate count to achieve maximum throughput is examined for each of the devices using an empirical CPI model under different power budget constraints. Based on this study, the optimal design of each beyond-CMOS device technology is demonstrated to improve EDP. Results in this work delineate an optimal EDP for a given range of power budgets, and provides insightful trends on key design parameters as well as optimal performance and power metrics based on the fast system-level optimization at the early design stage.
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