{"title":"精确互连建模:面向数百万晶体管芯片作为微波电路","authors":"N. V. D. Meijs, T. Smedes","doi":"10.1109/ICCAD.1996.569621","DOIUrl":null,"url":null,"abstract":"In this paper we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwave-like effects will become important. Therefore stronger demands are put on extraction and verification tools. We indicate the state-of-the-art for capacitance, resistance and substrate resistance extraction and discuss some open problems. We also discuss several model reduction techniques as well as issues related to simulation and implementation in a CAD system.","PeriodicalId":408850,"journal":{"name":"Proceedings of International Conference on Computer Aided Design","volume":"165 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Accurate interconnect modeling: Towards multi-million transistor chips as microwave circuits\",\"authors\":\"N. V. D. Meijs, T. Smedes\",\"doi\":\"10.1109/ICCAD.1996.569621\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwave-like effects will become important. Therefore stronger demands are put on extraction and verification tools. We indicate the state-of-the-art for capacitance, resistance and substrate resistance extraction and discuss some open problems. We also discuss several model reduction techniques as well as issues related to simulation and implementation in a CAD system.\",\"PeriodicalId\":408850,\"journal\":{\"name\":\"Proceedings of International Conference on Computer Aided Design\",\"volume\":\"165 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Conference on Computer Aided Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1996.569621\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Conference on Computer Aided Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1996.569621","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Accurate interconnect modeling: Towards multi-million transistor chips as microwave circuits
In this paper we discuss concepts and techniques for the accurate and efficient modeling and extraction of interconnect parasitics in VLSI designs. Due to increasing operating frequencies, microwave-like effects will become important. Therefore stronger demands are put on extraction and verification tools. We indicate the state-of-the-art for capacitance, resistance and substrate resistance extraction and discuss some open problems. We also discuss several model reduction techniques as well as issues related to simulation and implementation in a CAD system.