预测高性能,最低功耗CMOS ASIC技术:1998-2010

A. Bhavnagarwala, B. Austin, J. Meindl
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引用次数: 2

摘要

在规定的性能和工作温度范围内,电路设计技术最大限度地减少静态CMOS栅极的总功率损耗,用于规划1994年NTRS(国家半导体技术路线图)中列出的CMOS ASIC技术世代的电源电压,功率密度,器件阈值电压和关键路径器件通道宽度,直至2010年。这些预测与1994年NTRS技术和周期时间预测一致,并使用物理和随机模型,将CMOS ASIC设计层次的器件,电路和系统级别紧密耦合在一起。经过HSPICE和实际微处理器实现的验证,这些模型预测0.25-0.07 /spl mu/m代的最佳电源电压,从900 mV扩展到500 mV,功率密度从3 W/cm/sup 2/增加到10 W/cm/sup 2/,线限制高性能CMOS ASIC系统。
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Projections for high performance, minimum power CMOS ASIC technologies: 1998-2010
Circuit design techniques minimizing total power drain of a static CMOS gate for a prescribed performance and an operating range of temperatures are employed to project supply voltages, power densities, device threshold voltages and critical path device channel widths for CMOS ASIC technology generations listed in the 1994 NTRS (National Technology Roadmap for Semiconductors) up to the year 2010. These projections are consistent with 1994 NTRS technology and cycle time forecasts and use physical and stochastic models that tightly couple together the device, circuit and system levels of the CMOS ASIC design hierarchy. Verified by HSPICE and actual microprocessor implementations, these models project optimal supply voltages for 0.25-0.07 /spl mu/m generations to scale from 900 mV to 500 mV and power densities to increase from 3 W/cm/sup 2/ to 10 W/cm/sup 2/ in wire limited high performance CMOS ASIC systems.
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