{"title":"集成电路设计中的性能-可制造性权衡","authors":"H. Heineken, Wojciech Maly","doi":"10.1109/DATE.1998.655914","DOIUrl":null,"url":null,"abstract":"Traditional VLSI design objectives are to minimize time-to-first-silicon while maximizing performance. Such objectives lead to designs which are not optimum from a manufacturability perspective. The objective of this paper is to illustrate the above claim by performing performance/manufacturability tradeoff analysis. The basis for such an analysis, in which the relationship between a product's clock frequency and wafer productivity is modeled, is described in detail. New applied yield models are discussed as well.","PeriodicalId":179207,"journal":{"name":"Proceedings Design, Automation and Test in Europe","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-02-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Performance-manufacturability tradeoffs in IC design\",\"authors\":\"H. Heineken, Wojciech Maly\",\"doi\":\"10.1109/DATE.1998.655914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Traditional VLSI design objectives are to minimize time-to-first-silicon while maximizing performance. Such objectives lead to designs which are not optimum from a manufacturability perspective. The objective of this paper is to illustrate the above claim by performing performance/manufacturability tradeoff analysis. The basis for such an analysis, in which the relationship between a product's clock frequency and wafer productivity is modeled, is described in detail. New applied yield models are discussed as well.\",\"PeriodicalId\":179207,\"journal\":{\"name\":\"Proceedings Design, Automation and Test in Europe\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-02-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Design, Automation and Test in Europe\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DATE.1998.655914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Design, Automation and Test in Europe","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DATE.1998.655914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance-manufacturability tradeoffs in IC design
Traditional VLSI design objectives are to minimize time-to-first-silicon while maximizing performance. Such objectives lead to designs which are not optimum from a manufacturability perspective. The objective of this paper is to illustrate the above claim by performing performance/manufacturability tradeoff analysis. The basis for such an analysis, in which the relationship between a product's clock frequency and wafer productivity is modeled, is described in detail. New applied yield models are discussed as well.