用传输矩阵法分析带过孔的多层不规则配电平面

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967647

Joong-Ho Kim, M. Swaminathan

{"title":"用传输矩阵法分析带过孔的多层不规则配电平面","authors":"Joong-Ho Kim, M. Swaminathan","doi":"10.1109/EPEP.2001.967647","DOIUrl":null,"url":null,"abstract":"This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method\",\"authors\":\"Joong-Ho Kim, M. Swaminathan\",\"doi\":\"10.1109/EPEP.2001.967647\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967647\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967647","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文讨论了用多输入多输出传输矩阵法分析垂直过孔连接的多层矩形和不规则形配电网在频域上的部分自互感器模型。采用传输矩阵法，分析了不带去耦电容和带去耦电容时的通孔效应和多个矩形电源/地平面对的效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method

This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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