{"title":"集成光子封装，从研究到中试规模制造","authors":"P. O'Brien","doi":"10.23919/MOC52031.2021.9598063","DOIUrl":null,"url":null,"abstract":"An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.","PeriodicalId":355935,"journal":{"name":"2021 26th Microoptics Conference (MOC)","volume":"45 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing\",\"authors\":\"P. O'Brien\",\"doi\":\"10.23919/MOC52031.2021.9598063\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.\",\"PeriodicalId\":355935,\"journal\":{\"name\":\"2021 26th Microoptics Conference (MOC)\",\"volume\":\"45 1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 26th Microoptics Conference (MOC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/MOC52031.2021.9598063\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 26th Microoptics Conference (MOC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MOC52031.2021.9598063","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Photonics Packaging for Integrated Photonics, from Research to Pilot Scale Manufacturing
An overview of the European Packaging Pilot Line for Photonic Integrated Circuits is presented. The Pilot Line organisation and operation plan based on standardised packaging building blocks, design rules and assembly design kits is reviewed. Examples of packaged integrated photonic modules developed by the Pilot Line is also presented.
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