CuPc活性材料OFET的阈值电压特性

Hoshik Lee, Seong G. Kim
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引用次数: 0

摘要

在这项研究中,使用酞菁铜(CuPc)材料作为有源层,二氧化硅作为栅极绝缘体,制备了具有不同有源层厚度和沟道长度的有机场效应晶体管(ofet)。在此基础上,利用热蒸发法在高真空系统中制备了顶接触型CuPc FET器件,源极和漏极均采用金材料。为了讨论沟道形成和FET特性,我们观察了典型的电流-电压特性,并计算了CuPc FET器件的阈值电压。我们还发现,在负施加电压下,电容达到约97 pF,并且随着载流子在金属和CuPc材料界面上的积累而增加。我们观察了FET用作n沟道FET时的典型行为。此外,我们计算出阈值电压在V DS = -80 V时约为15-20 V。
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Threshold Voltage Properties of OFET with CuPc Active Material
In this study, organic field-effect transistors (OFETs) using a copper phthalocyanine (CuPc) material as an active layer and SiO₂ as a gate insulator were fabricated with varying active layer thicknesses and channel lengths. Further, using a thermal evaporation method in a high-vacuum system, we fabricated a CuPc FET device of the top-contact type and used Au materials for the source and drain electrodes. In order to discuss the channel formation and FET characteristics, we observed the typical current–voltage characteristics and calculated the threshold voltage of the CuPc FET device. We also found that the capacitance reached approximately 97 pF at a negative applied voltage and increased upon the accumulation of carriers at the interface of the metal and the CuPc material. We observed the typical behavior of a FET when used as an n-channel FET. Moreover, we calculated the threshold voltage to be about 15–20 V at V DS = –80 V.
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